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Saint-Gobain K250X
Polyimide Tape

General Information
K250X is a 2.5 mil, thick, polyimide backing material with a high temperature, silicone pressure sensitive tape. It was constructed to fill the requirements of a high performance thermosplastic polyimide backing materials. K250X is chosen for gold finger protection during wave solder applications.
Backing Adhesive
(unwind)
Thickness
(total)
Liner Type
(outer)
Polyimide Silicone 2.50 mil  

Adhesion to Steel
180° Peel
Adhesive Activation Tensile Strength Elongation Percent
25.00 oz/in Pressure 25.00 lbs/in 50.00%

Min Application
Temp
Min Service
Temp
Max Short-Term
Temp
Max Long-Term
Temp
20 °F 0 °F    
Adhesive Tape Features
  • High dielectric strength
  • Excellent dimensional stability
  • Superior chemical resistance
  • Puncture, tear and nick resistant
  • No flagging
  • Clean removal
Adhesive Tape Applications
  • Gold finger protection during wave soldering.
Adhesive Tape Markets Served
Adhesive Tape Colors

Comparable products

Backing Adhesive Thickness Adhesion
 Polyimide   Silicone   2.50mil   25.00oz/in 
Backing Adhesive Thickness Adhesion
 PET - Polyester   Silicone   2.50mil   20.00oz/in 

Converting Options
Converting Services
Budnick Converting offers a number of services to take the product you need and make it perfect for your application.  With converting methods ranging from precision slitting or die-cutting to printing and coating, Budnick has the capabilities to create anything you can dream up. 
Services
Precision Cutting

Die-Cutting

Slitting

Printing

Adhesive Coating

Finishing and Spooling
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