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Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 40 Mils
Adhesion
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4910 is a 40 mil, VHB™ double coated, clear solid acrylic. The general purpose adhesive bonds to most higher surface energy substrates .

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 15 Mils
Adhesion
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4920 is a high performance VHB™ adhesive that has excellent long-term holding power. 4920 has a general purpose adhesive on both sides of a firm type foam.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 25 Mils
Adhesion
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4930 is a 25 mil, VHB™ double coated adhesive foam. In many cases they can replace rivets, spot welds, liquid adhesives or other permanent fasteners.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 25 Mils
Adhesion
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3M 4936 is a 25 mil, VHB™, double-coated, conformable acrylic foam. 4936 is the main product when conformability is necessary. 4936 utilizes multi-purpose acrylic adhesive.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 10 Mils
Adhesion
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3M VHB™ 4914 is a 10 mil double coated acrylic foam. It is the thinnest tape in 3M's VHBT line.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 6 Mils
Adhesion
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3M VHB™ Thin Foam Tape 86415 is a thin foam tape with pressure sensitive adhesive on both sides used for bonding a wide range of high and low surface energy materials in the electronics industry.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 8 Mils
Adhesion
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3M VHB™ Thin Foam Tape 86420 is a thin foam tape with pressure sensitive adhesive on both sides used for bonding a wide range of high and low surface energy materials in the electronics industry.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 10 Mils
Adhesion
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3M VHB™ Thin Foam Tape 86425 is a thin foam tape with pressure sensitive adhesive on both sides used for bonding a wide range of high and low surface energy materials in the electronics industry.

Backing/Carrier Acrylic Foam
Adhesive Acrylic
Thickness 12 Mils
Adhesion
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3M VHB™ Thin Foam Tape 86430 is a thin foam tape with pressure sensitive adhesive on both sides used for bonding a wide range of high and low surface energy materials in the electronics industry.

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