As an industry leader in specialty converting technology, Budnick offers electronic engineers the design freedom to solve problems with adhesive tape and gasket dimensions that are considered unmachinable with conventional tooling. With capabilities such as in-line laser cutting, waterjet cutting, die-cutting and extremely narrow slitting; we produce the parts that others say can't be machined. Whether you need engineering design assistance, prototypes, finished gaskets or kiss-cut parts on a roll, Budnick is your one-stop source. We provide products and services for computer systems, document management, telecommunications, networking and semi conductor manufacturers.
As electronic equipment becomes smaller, power sources are concentrated in tighter areas. This confinement creates heat problems that can be counteracted (bled off) with our thermally conductive material. These products dissipate heat away from power transistors and microprocessors to the ambient environment. Heat dissipation is critical to optimize processing speed and expand the life expectancy of modem processors.
Budnick offers engineers the design freedom necessary to solve heat related problems. Our broad range of converting capabilities, from narrow width slitting to in-line laser cutting micro parts, makes many design shapes and sizes a reality. Many parts that are impossible to produce with conventional tooling are now available through in-line laser technology. Due to the advancement in thermal management products and Budnick's converting capabilities, system designers can provide efficient thermal interfaces without increasing assembly costs or processing time. Business development specialists and project engineers are trained to assist you in developing automated, mass production methods of applying your thermal management products. We will work with you to figure out a converting method that creates parts for your most efficient design. Budnick is the place to turn when others are telling you it can't be done.
Budnick offers products such as thermally conductive graphite adhesive tapes, phase change thermal pads, thermally conductive silicone sponge gaskets and non-toxic, fire-blocking silicone foam gaskets.
EMI / RFI Shielding
Budnick offers copper and aluminum foil products, metallized fabrics, conductive elastomers and composite materials. All of these products may be provided with conductive or non-conductive adhesives. These electro-magnetic and radio frequency interference shielding tapes offer reliable point-to-point contact, grounding and static charge draining. What truly sets Budnick apart from our competition is the ability to fabricate parts of almost any size or shape and the foresight to provide these parts in a manner that will maximize efficiency in the production process.
Printed Circuit Board
Printed circuit board tapes prevent plating solution undercutting, withstand chemical contact, resist temperatures, last through multiple operating cycles and remove cleanly. Budnick offers tin lead stripping plating tapes, fume protection tapes, solder masking tapes, hot air leveling tapes, polyimide (Kapton®) film tapes and silicone rubber coated fabrics. Conformability, inertness and high thermal stability make these products ideal for electronic applications.
Budnick can provide PCB tapes in almost any width or shape.
Bonding / Joining
The electronics industry is realizing the aesthetic advantages of bonding with adhesive tapes rather than using mechanical fasteners. Many adhesives meet the challenge of bonding to a wide variety of substrates under extreme heat and through exposure to a broad range of service conditions. Adhesive tapes offer conformability to curved surfaces, bonding to rough or irregular surfaces and contamination free fastening.
Budnick provides die-cutting, laser cutting, narrow width slitting and traverse winding to make bonding tapes more efficient to use.