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Permacel/Nitto Denko America 318 H-15
Chip Carrier Cover Tape

General Information
318 H-15 is a 2 mil, chip carrier cover tape. It is specifically designed for use in a packaging and carrying system to mount chip-type leadless components onto printed circuit boards. The adhesive bonds firmly to an embossed plaastic carrier after heat activation.
Backing Adhesive
(unwind)		 Thickness
(total)		 Liner Type
(outer)
PET - Polyester   2.00 mil  

Adhesion to Steel
180° Peel		 Adhesive Activation Tensile Strength Elongation Percent
  Heat   50.00%

Min Application
Temp		 Min Service
Temp		 Max Short-Term
Temp		 Max Long-Term
Temp
40 °F 0 °F    
Adhesive Tape Features
  • Long-term storage stability of tape
  • Tape doesn't weld to the chips after heat treating so placement of the chip onto the printed circuit board is totally unrestricted
  • Adhesive bonds firmly to the carrier, yet permits easy, clean release at time of insertion
  • Application = embossed plastic carrier
  • Recommended activation temperature = 100°-140° C/1 second
Adhesive Tape Applications
  • Mount chip-type leadless components onto printed circuit boards
Adhesive Tape Markets Served
Adhesive Tape Colors

Comparable products

Permacel/Nitto Denko America 318 H-15 View Datasheet
Chip Carrier Cover Tape
Backing Adhesive Thickness Adhesion
 PET - Polyester      2.00mil   oz/in 

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